Wuxi, March 16, 2026 – Don McGuire, Executive Vice President and Chief Marketing Officer (CMO) of Qualcomm, visited Autolink (Wuxi Auto Intelligence Tech Co., Ltd.). He held in-depth discussions with Autolink's management team regarding the collaborative achievements and future development direction in the field of intelligent vehicles. As long-term partners, the two parties are continuing to deepen their collaboration in smart cockpit and Cockpit-Driving integration computing platforms, jointly promoting the evolution of automotive E/E architecture towards a higher level of intelligence.
In recent years, Autolink and Qualcomm have engaged in deep collaboration on multiple core computing platforms for intelligent vehicles, consistently driving technological innovation and industrial implementation.
(Group photo of Don McGuire and the Autolink management team)
• The AL-C1 Intelligent Cockpit Product, developed based on the Qualcomm® Snapdragon® 8155 Platform, has achieved mass production with several mainstream automotive brands. As of June 30, 2025, its cumulative shipments have surpassed 2 million units[ According to Frost & Sullivan], establishing itself as a leading smart cockpit solution globally.
• The AL-C2 High-End Intelligent Cockpit Domain Controller, launched based on the Qualcomm Snapdragon 8255 Platform, was applied in Chery Jetour Zongheng G700, in September 2025. It further enhances in-vehicle computing power and multi-screen interaction experience, providing robust computing support for high-end smart cockpit applications.
• The Cockpit-Driving Integration Domain Controller, developed based on the Qualcomm Snapdragon SA8775 Platform, has brought a single-SoC cockpit-driving integration solution to mass production. It was applied in the all-new ARCFOX αT5 model, reflecting the industry trend of automotive computing architecture evolving towards centralization.
Building on this foundation, the collaboration has expanded to include the Snapdragon Digital Chassis Platforms. Autolink is advancing the research and development of next-generation intelligent automotive computing platforms based on the Qualcomm Snapdragon 8397 and 8797 Platforms.
At CES 2026, Autolink unveiled its next-generation intelligent vehicle architecture, AI Link 3.0 Deep Fusion EEA. Its central computing platform utilizes the Qualcomm Snapdragon SA8797 Platform. By coordinating a centralized computing architecture with distributed edge computing nodes, it aims to achieve deep integration of vehicle-wide data, software, and hardware capabilities, further advancing intelligent vehicle E/E architecture towards a central computing platform.
During the visit, McGuire and his delegation toured Autolink's fully automated intelligent manufacturing production line. They gained a thorough understanding of the scaled manufacturing system for the collaborative domain controller products and witnessed the complete manufacturing process from production and testing to quality verification.
Subsequently, McGuire experienced the production vehicle that features the single-SoC cockpit-driving integration solution—the all-new ARCFOX αT5. Based on the Qualcomm Snapdragon SA8775 Platform and Autolink's Cockpit-Driving Integration Domain Controller solution, this model achieves efficient synergy between the smart cockpit and driving systems, demonstrating a leading intelligent vehicle experience.
