简体中文

Autolink Brings Intelligent Vehicle Innovation Closer to European Development Needs at IZB 2026

Date:10/28/2026

75a3a594-7a46-40da-96cb-2fc05963011c.jpg

IZB Exhibition Venue (File Photo; Source: Wolfsburg AG)

Production-proven domain controllers, on-device AI and next-generation E/E architecture open multiple paths for collaboration

WOLFSBURG, Germany, October 27, 2026 — Autolink is exhibiting intelligent cockpit and cockpit-driving domain controllers, its AI-Box on-device AI computing unit, and an optical communication E/E architecture demonstrator at the International Suppliers Fair (IZB) 2026. The portfolio addresses current vehicle development, AI capability expansion and future architecture evolution, supporting dialogue with European automakers, Tier 1 suppliers and engineering partners.

f5da9cdb-f8c8-4ab4-a47b-6096295fdb7b.jpgIZB 2026 China Pavilion

Located within the CIPA-HUB Chinese exhibition area at Hall 6, Booth 6122-A1, Autolink is building on its architecture demonstrations and technical discussions at ELIV. Its European event series now moves further into customer requirements, using tangible products to demonstrate system development, quality assurance and engineering delivery capabilities.

Bringing Vehicle Development Questions to the European Supply Chain

Organized by Wolfsburg AG, IZB is an international trade fair for the automotive supply industry with close links to the Volkswagen Group and its supplier ecosystem. Taking place on October 27–29, it provides a platform for automakers, suppliers and technology partners to evaluate products and explore business opportunities. The CIPA-HUB brings together Chinese automotive suppliers to support technology presentations and industry exchange between China and Europe.

fc195e3b-a118-40d2-b02d-3d574a93c477.pngAutolink's European team presents the company's products at the exhibition.

For Autolink, IZB offers an opportunity to engage with practical development questions: Which cockpit and computing platforms suit different vehicles? How can AI be introduced into existing platforms? How can future architectures align with vehicle development processes?

Autolink's exhibits address these questions at different stages of development, helping potential customers and partners assess technical compatibility and identify starting points for joint development.

Different Development Stages, Different Product Paths

For current vehicle programs, Autolink is showcasing its AL-C2 intelligent cockpit domain controller, based on the Qualcomm Snapdragon SA8255P platform, and its AL-A1 cockpit-driving integrated domain controller, based on the Qualcomm Snapdragon SA8775P platform.

AL-C2 High-End Intelligent Cockpit Domain Controller (Based on SA8255P)

AL-A1 Cockpit-Driving Integration Domain Controller (Based on SA8775P)

Both products have entered production in vehicle models, providing practical references for platform maturity, system integration and delivery at scale. Alongside functionality, discussions around specific programs also encompass stability, reliability, and development and validation processes.

For AI upgrades to existing cockpit platforms, AI-Box provides a separate computing expansion path. It can connect to existing platforms to support large-model inference and multimodal perception, allowing customers to assess how to introduce AI functions according to vehicle positioning and development schedules.

For next-generation vehicle platforms, the optical communication E/E architecture demonstrator presents AI Link 3.0 Deep Fusion EEA. It brings together central computing, zonal controllers and a high-speed optical communication backbone to illustrate an approach to cross-domain data sharing and coordinated computing.

Together, these products create multiple starting points for cooperation. Customers can begin with a specific vehicle program, an AI application or a future architecture study, then work with Autolink to define a solution suited to their requirements.

51da0695-0cf8-4406-bf11-9e48c849e869.jpgAutolink AI Link 3.0 Deep Fusion EEA Demo Vehicle

“From CES 2026 to the recent ELIV congress, the deeply integrated architecture approach behind AI LInk 3.0 Deep Fusion EEA has continued to attract industry interest and discussion,” said Ethan Li, CSO & VP of Autolink. “We have the ambition to challenge conventional vehicle architectures and the engineering commitment to move new ideas toward real applications through product development, joint validation and manufacturing capabilities. Europe is central to that commitment. We are strengthening our local business and R&D teams and building production capabilities in Europe, making collaboration more direct and efficient for European brands. By combining forward-looking technology with disciplined engineering execution, we aim to become a key partner in developing their next generation of vehicles.”

Building Long-Term Cooperation Through Production Experience and Local Engineering

Technology demonstrations begin the conversation. Moving into vehicle development requires a shared understanding of requirements, system adaptation and validation. Autolink brings its production experience to Europe and works through local teams and engineering partners to address customer expectations for performance, safety, compatibility and long-term support.

71879005-ddfb-4719-8b51-3462d06ad69a.jpgAttendees engage in discussions at the Autolink booth

The company continues to strengthen its business and R&D presence in France, Germany and Romania, drawing on local resources for customer engagement, joint development and system validation. Autolink is also conducting a joint proof of concept with EDAG around Deep Fusion EEA to assess European market suitability and vehicle integration pathways.

From technical discussions at ELIV to supply chain engagement at IZB, Autolink continues to deepen its connections with Europe's automotive industry. Through its product capabilities and quality practices, the company aims to develop concrete opportunities with automakers, Tier 1 suppliers and engineering partners, bringing intelligent vehicle innovation into vehicle programs and applications.

Visit Autolink at Hall 6, Booth 6122-A1, October 27–29.


About Autolink

Autolink continues to advance intelligent vehicle architectures through R&D investment in central computing, E/E architectures and on-device AI, building core technologies for intelligent driving and cockpit infrastructure for the era of physical AI.