Autolink and Zhuoyu Technology Deepen Partnership Towards Central Computing
Beijing, April 26, 2026 – At the 2026 Beijing Auto Show, Autolink and Shenzhen Zhuoyu Technology (“ZYT”) signed a strategic partnership upgrade agreement.
Building on their successful collaboration on the Qualcomm Snapdragon Ride Flex (SA8775P) , the companies will deepen cooperation around the Qualcomm Snapdragon Ride Elite (SA8797P) , advancing from single-chip fusion to the central computing era.
World's First Single-Chip Solution in Mass Production
Since partnering in 2024, Autolink and ZYT have successfully developed and mass-produced the AL-A1 Cockpit-Driving Integrated Domain Controller based on the Snapdragon Ride Flex platform. This 144-TOPS solution runs both cockpit and ADAS tasks on a single SoC, marking the technology's shift from validation to volume production. It is deployed in models including the BAIC Alpha T5 and S5.
Next-Generation Central Computing Collaboration
The new agreement focuses on the SA8797P, Qualcomm's flagship solutions for next-generation central computing. The partnership will drive customer acquisition and technical adaptation for these high-performance platforms, targeting broader adoption by global OEMs. At the show, Autolink showcased its central computing solution based on the SA8797P, demonstrating substantive progress in this field.
Driving Industry Evolution
The partnership's evolution—from the SA8775 to the SA8797—represents a leap from chip-level to system-level integration. It provides automakers with a complete solution path, accelerating the industry's transition to central computing.
The 2026 Beijing Auto Show runs until May 3. Autolink invites visitors to Booth A204, Hall A2 at the China International Exhibition Center (Shunyi) to learn more.
