From smart cockpit domain controllers with cumulative shipments exceeding 2.3 million units (Frost & Sullivan) to the industry's first mass-produced single-chip cockpit-driving fusion solution and onward to central computing architectures for the AI era, Autolink is leveraging its product innovation and mass production expertise to propel the intelligent automotive industry into a new stage of development.
Seven Years of Collaboration: From Mass Production to AI Co-creation
The collaboration between Autolink and Qualcomm Technologies spans seven years. From Snapdragon 8155 to 8255, then to 8775 and 8797, together they have witnessed China's automotive electronics industry evolve from technology application to architectural innovation.
The AL-C1 smart cockpit domain controller built on the Snapdragon 8155 platform has achieved scaled mass production with multiple mainstream automotive brands. According to Frost & Sullivan, as of May 22, 2026, cumulative shipments have surpassed 2.3 million units, ranking first globally.
In 2025, Autolink launched the AL-C2 high-end smart cockpit domain controller based on Snapdragon 8255 and the AL-A1 cockpit-driving fusion domain controller based on Snapdragon 8775. The AL-A1 led the industry in mass-producing a single-chip cockpit-driving fusion solution, debuting on the Arcfox Alpha T5 and subsequently applied to the Arcfox Alpha S5 and Arcfox Wen Dao V9, driving the technology from concept verification to industrial application.
During the 2025 Qualcomm Summit, the two parties signed a strategic cooperation agreement based on Snapdragon 8397 and 8797 platforms, expanding collaboration in mid-to-high-end smart cockpits, cockpit-driving fusion, and next-generation central computing platforms.
From 8155 to 8797, the two parties have formed a long-term, multi-platform cooperation system, upgrading from technology collaboration to industry co-creation. Entering the AI era, their collaboration is further extending to joint innovation in central computing architectures, on-device AI capabilities, and next-generation intelligent vehicle computing platforms.
Toward Central Computing: Snapdragon 8797 Powers AI Link 3.0 Deep Fusion EEA
As large AI models, smart driving, and smart cockpits continue to evolve, automotive E/E architectures are accelerating toward central computing.
During the summit, Autolink highlighted the AL-A2 cockpit-driving fusion domain controller built on the Snapdragon 8797 platform. Designed for next-gen central computing, this platform delivers higher computing power and stronger AI scalability. Through central and distributed edge computing synergy, it provides a unified foundation for smart driving, smart cockpits, and on-device AI applications.
At the same time, Autolink spotlighted the AI Link 3.0 Deep Fusion EEA central computing architecture. Released by Autolink at CES 2026, it is the world's first deeply integrated E/E architecture, comprising a central computing platform, zone controllers, and a high-speed optical communication backbone network. Leveraging centralized computing and high-speed interconnects, it enables efficient coordination of perception, decision-making, control, and interaction.
Compared with traditional distributed E/E architectures, it supports smart driving, smart cockpits, and on-device large AI models with lower latency and higher efficiency, building a unified, open, and continuously evolvable intelligent computing foundation for future vehicles.
The AL-A2 cockpit-driving fusion domain controller based on Snapdragon 8797 is actively advancing toward industrial adoption, further validating the feasibility and commercial value of scaling central computing architectures.
Industry Partners Take Keen Interest, Discussing Next-Generation Automotive Architectures
During the summit, the Autolink exhibition area attracted numerous industry partners to visit.
After the visit, an R&D leader from a top domestic OEM said: "Autolink's mass production experience on Snapdragon 8155, 8255, and 8775 platforms is very solid. We have already had in-depth cooperation on multiple projects. This central computing solution based on the 8797 platform not only demonstrates a clear technology evolution roadmap, but also reflects the deep integration of AI capabilities with vehicle architecture, giving us great confidence in next-generation intelligent vehicle architectures."
A representative from a European OEM, after experiencing the cockpit in a demo vehicle, commented: "The iteration speed and mass production capabilities of Chinese suppliers in the field of intelligence are impressive. Autolink not only has hardware platform upgrades, but also demonstrates system-level design foresight in the AI Link 3.0 architecture. The deep integration of on-device AI and cockpits is precisely a key direction for the future global automotive industry."
From mass production capabilities to architectural innovation, from product delivery to AI capability building, Autolink continues to gain attention and recognition from global industry chain partners.
AI Defines Mobility: Autolink Continues to Lead Industry Transformation
The theme of this year's Qualcomm summit was "Intelligent Journey," with on-vehicle large AI models taking center stage.
At the summit, Autolink highlighted the cockpit-driving fusion domain controller based on Snapdragon 8797, which supports localized deployment of 13B on-device large models, as well as the AI-Box on-device AI computing unit based on Qualcomm 9075, providing an AI upgrade path for existing vehicle models.
Autolink is also maintaining technical collaboration with partners such as ModelBest, Doubao, and Qingzhou around on-device large AI model applications, advancing verification and exploration of mass production pathways in cockpit interaction, smart assistants, and scenario-based services.
Yang Hongze, Founder and Chairman of Autolink, said: "Over the next decade, the core of competition in the automotive industry will gradually shift from hardware capabilities to AI capabilities. Central computing architecture is not only an upgrade of the E/E architecture, but also crucial infrastructure for the scaled implementation of AI capabilities. Whoever can take the lead in deeply integrating AI capabilities with vehicle architecture will gain a first-mover advantage in the next phase of industry competition."
From smart cockpits to cockpit-driving fusion, from AI Box to central computing architectures, Autolink is continuously building intelligent computing platforms for the AI era.
Looking ahead, Autolink will continue to deepen collaborative innovation with core technology partners such as Qualcomm, with sustained investment in central computing, zone control, high-speed communication, and on-device AI. Driving industry upgrading via architectural innovation and AI-powered mobility, Autolink aims to accelerate the scaled deployment of next-generation E/E architectures.
