Autolink presented its latest AI-driven E/E architecture innovations at the 2026 Shanghai International Carbon-Neutral Smart Mobility Exhibition (GSA 2026,2nd JUN), demonstrating how the company is evolving from a smart cockpit domain controller supplier into a provider of next-generation vehicle-wide intelligence platforms. The showcase featured a complete technology portfolio spanning smart cockpit domain controllers, cockpit-driving integrated domain controllers, AI Box solutions, and the AI Link 3.0 Deep Fusion EEA central computing architecture, reflecting Autolink's long-term vision for AI-native vehicles.
From Intelligent Cockpits to Vehicle-Wide Intelligence
As the automotive industry enters the era of AI-native and software-defined vehicles, centralized computing, on-device AI, AI Agents, and domain convergence are rapidly reshaping next-generation vehicle architectures. Against this backdrop, Autolink's latest portfolio demonstrates a clear technology roadmap—from intelligent cockpit computing to cockpit-driving integration and ultimately vehicle-wide intelligence.
The AL-C2 Smart Cockpit Domain Controller delivers immersive in-vehicle digital experiences through Autosee Smart Cockpit, supporting intelligent interaction, multi-screen collaboration, and integrated interior-exterior perception.
The AL-A1 Cockpit-Driving Integrated Domain Controller, a pioneering mass-produced single-chip solution, consolidates cockpit and ADAS workloads on a single SoC. Equipped with a 4.4-billion-parameter on-device AI model, it has entered mass production on multiple production vehicles.
Built for the central computing era, the AL-A2 Cockpit-Driving Integrated Domain Controller significantly expands computing performance and AI scalability. Supporting on-device AI, multi-domain collaboration, and in-vehicle AI Agents, its scalable architecture is designed to meet the evolving requirements of L3/L4 autonomous driving, Robotaxi platforms, and emerging embodied intelligence applications.
Accelerating AI Adoption Across Vehicle Platforms
Autolink also introduced its AI Box solution, enabling OEMs to integrate on-device AI capabilities into existing vehicle platforms with minimal architectural changes. Combining AI large-model inference with multimodal perception in automotive-grade hardware, AI Box provides a practical and cost-effective pathway for accelerating intelligent feature deployment.
AI Link 3.0: The Foundation of the Central Computing Era
At the center of Autolink's technology roadmap is AI Link 3.0 Deep Fusion EEA, the company's next-generation centralized E/E architecture first introduced at CES 2026. Integrating a central computing platform, zonal controllers, and a high-speed optical communication backbone, the architecture delivers up to 256 Gbps bidirectional bandwidth and sub-microsecond latency.
Powered by the Snapdragon 8797 together with high-performance edge computing, AI Link 3.0 establishes a scalable 'central + edge' computing framework that deeply integrates computing, communication, and control, providing the foundation for AI-native vehicles, in-vehicle AI Agents, L3/L4 autonomous driving, and future Robotaxi applications.
Looking Ahead
As of the end of May 2026, Autolink had secured 164 design wins across all of China's top five passenger vehicle brands. Guided by its strategy of evolving from "Product AI" to "Vehicle AI," the company continues to expand its capabilities in central computing, zonal control, high-speed communication, and on-device AI.
Looking ahead, Autolink will continue working with global OEMs and ecosystem partners to accelerate the transition toward AI-driven, software-defined vehicles, delivering scalable intelligent computing platforms for the next generation of mobility.
